Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate
2007-05-15
2007-05-15
Menz, Doug (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Outside periphery of package having specified shape or...
C257S620000, C257S680000, C257S724000
Reexamination Certificate
active
11030288
ABSTRACT:
The present invention provides an electronic device comprising a base substrate to be surface-mounted on a circuit board, one or more electronic component elements mounted on a surface of the base substrate and/or therein, an external electrode provided on an end portion of the base substrate and in the form of a post perpendicular to a rear surface of the base substrate for connecting the one or more electronic component elements to the circuit board. Furthermore, the base substrate is provided on its end portion with a slope crossing a side surface and a rear surface of the base substrate. A surface of the external electrode is exposed on the slope.
REFERENCES:
patent: 6856026 (2005-02-01), Yamada et al.
patent: 2976049 (1994-04-01), None
patent: 2002-353071 (2002-12-01), None
Fukuyama Masami
Hongo Masanori
Nagano Natsuyo
Ogura Takashi
Armstrong Kratz Quintos Hanson & Brooks, LLP
Menz Doug
Sanyo Electric Co,. Ltd.
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