Electronic device and heat dissipation unit thereof

Details Electronic device and heat dissipation unit thereof Electronic device and heat dissipation unit thereof

2009-02-26

2010-10-12

Chervinsky, Boris L (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S699000, C361S704000, C361S707000, C174S015200, C165S104260

Reexamination Certificate

active

07813130

ABSTRACT:
A heat dissipation unit is provided. The heat dissipation unit includes a heat sink, a first fixing station, a first heat pipe, a second fixing station and a second heat pipe. The first fixing station is located on a first plane. The first heat pipe is connected to the first fixing station and the heat sink. The second fixing station is located on a second plane, wherein a gap is formed between the first plane and the second plane. The second heat pipe is connected to the second fixing station and the heat sink, wherein the first fixing station partially overlaps the second fixing station.

REFERENCES:
patent: 7079394 (2006-07-01), Mok
patent: 7212404 (2007-05-01), Wang et al.
patent: 7274572 (2007-09-01), Wang et al.
patent: 7310224 (2007-12-01), Yang et al.
patent: 7474526 (2009-01-01), Fujiwara
patent: 7551442 (2009-06-01), Stefanoski
patent: 7561417 (2009-07-01), Hung et al.

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