Electronic device and assembling method thereof

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Within distinct housing spaced from panel circuit arrangement

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C439S065000, C439S067000

Reexamination Certificate

active

07841870

ABSTRACT:
An electronic device and an assembling method thereof are provided. The electronic device includes a first electronic module, a second electronic module, and a through connection element. The first electronic module includes a plurality of electronic units, a plurality of lead wires, a daughterboard, and a first connector. The first connector is disposed on the daughterboard. The lead wires are separately connected between the electronic units and the daughterboard. The daughterboard is electrically connected between the lead wires and the first connector. The second electronic module includes a motherboard and a second connector, wherein the second connector disposed on the motherboard is electrically connected with the motherboard. The through connection element being assembled between the first and the second connectors is electrically connected to the first and the second connectors to connect the first electronic module with the second electronic module.

REFERENCES:
patent: 3660728 (1972-05-01), Carter
patent: 5362243 (1994-11-01), Huss et al.
patent: 5735696 (1998-04-01), Niitsu et al.
patent: 6293805 (2001-09-01), Wu

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Electronic device and assembling method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic device and assembling method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic device and assembling method thereof will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4227803

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.