Electronic device

Details Electronic device Electronic device

2010-03-25

2011-12-06

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S719000, C257S706000, C257S712000, C165S080300

Reexamination Certificate

active

08072759

ABSTRACT:
According to one embodiment, an electronic device includes a printed circuit board housed in a housing, a surface mount part soldered to the printed circuit board, a cooling mechanism which covers the surface mount part from an opposite side to the printed circuit board, a reinforcing portion formed by supplying an adhesive to an outer peripheral edge of the surface mount part and the printed circuit board such as to be across each other, which reinforces a solder joint portion provided between the surface mount part and the printed circuit board and a spacer formed of the adhesive, which is set between the surface mount part and the cooling mechanism and supports the cooling mechanism.

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Notice of Reasons for Rejection mailed by Japan Patent Office on Jun. 1, 2010 in the corresponding Japanese patent application No. 2009-134350.
Notice of Reasons for Rejection mailed by Japan Patent Office on Sep. 28, 2010 in the corresponding Japanese patent application No. 2009-134350.

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