Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2010-05-25
2011-10-04
Thompson, Gregory (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S104330, C361S694000, C361S695000
Reexamination Certificate
active
08031469
ABSTRACT:
According to one embodiment, the electronic device includes a housing, the first to third printed circuit boards, and a fan unit. The first printed circuit board includes the first heat-generating part secured to the first wiring board. The second printed circuit board includes the second and third heat-generating parts, has an amount of heat generation larger than that of the first printed circuit board, and is located between the first printed circuit board and the second wall. The third printed circuit board includes the fourth heat-generating part, has an amount of heat generation smaller than that of the first printed circuit board, and is located between the first printed circuit board and the first wall.
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Notice of Reasons for Rejection mailed by Japan Patent Office on Aug. 3, 2010 in the corresponding Japanese patent application No. 2009-228133.
Notice of Reasons for Rejection mailed by Japan Patent Office on Oct. 26, 2010 in the corresponding Japanese patent application No. 2009-228133.
Information Sheet for preparing an Information Disclosure Statement under Rule 1.56.
Translation of Reference for JP U58-27895 A.
Hongo Takeshi
Tomioka Kentaro
Kabushiki Kaisha Toshiba
Knobbe Martens Olson & Bear LLP
Thompson Gregory
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