Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2009-06-12
2010-10-12
Dinh, Tuan T (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S760000, C361S752000, C361S818000
Reexamination Certificate
active
07813138
ABSTRACT:
According to one embodiment, an electronic device includes, a conductive housing, a substrate, a flexible substrate, a reinforcing element, and a conductor. The substrate is configured to be housed in the housing and is mounted with an electronic component. The flexible substrate includes a conductive signal layer stacked on a flexible insulating base material and electrically connected to the substrate, a cover layer covering the signal layer, a first surface mounted with the substrate, and a second surface on the reverse side of the first surface, having a portion where the signal layer is partially exposed. The reinforcing element is provided on the second surface to reinforce the flexible substrate and has an opening corresponding to the portion where the signal layer is partially exposed. The conductor is inserted from the opening of the reinforcing element and connects the signal layer to the housing.
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Notification of Reasons for Rejection mailed by Japan Patent Office on Dec. 1, 2009 in the corresponding Japanese patent application No. JP 2008-243380.
Explanation of Non-English Language References.
Maehara Daisuke
Takeguchi Koichiro
Dinh Tuan T
Kabushiki Kaisha Toshiba
Knobbe Martens Olson & Bear LLP
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