Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2007-05-08
2007-05-08
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257SE51040, C257S048000, C257S620000, C257S528000, C257S532000, C257S696000, C257S685000, C257S777000, C073S204220, C073S204250, C073S204110
Reexamination Certificate
active
10630773
ABSTRACT:
The conductor wire surface for constituting a circuit formed by print or junction on a substrate formed from a composite member of ceramics, resin, and an inorganic member and from a resin member is coated with glass, resin, solder, or silver paste, thus the corrosion resistance can be improved, and a highly reliable electronic device for car use can be provided. Further, the probing portion necessary for adjustment of the resistance and characteristics and the mounting portion for mounting parts are formed in a shape having no corners at 90° or less, for example, in a circular shape, in an elliptical shape, or in a shape that the corners of a tetragon are rounded (R) or chamfered (C).
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German Office Action dated Mar. 20, 2006, including an English translation of pertinent portion (Seven (7) pages).
Abe Hiroyuki
Igarashi Shinya
Yogo Takayuki
Crowell & Moring LLP
Hitachi Car Engineering Co. Ltd.
Williams Alexander Oscar
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