Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
1999-04-28
2002-06-04
Paladini, Albert W. (Department: 2827)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S255000, C361S760000, C439S074000
Reexamination Certificate
active
06399893
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an electronic device suitable for use in, for example, transmitter-receiver unit of a portable telephone.
2. Description of the Prior Art
A conventional electronic device will now be described with reference to
FIGS. 6
to
8
. A box-shaped frame
21
formed by a metallic plate is provided with side walls
21
a
which define an inside space having upper and lower openings and is also provided with mounting legs
21
b
formed in the side walls
21
a.
On a printed circuit board
22
is formed a conductive pattern
23
, to which various electric parts (not shown) are soldered to constitute a desired circuit.
The printed circuit board
22
is inserted from below the frame
21
into the inside space defined by the frame
21
and is secured to the frame by bending the mounting legs
21
b
inwards.
The mounting legs
21
b
and the conductive pattern
23
are soldered together at
24
to earth the conductive pattern
23
to the frame
21
.
As shown in
FIG. 8
, the electronic device such as a transmitter-receiver unit constructed as above is then mounted onto such as a mother printed circuit board
25
of the portable telephone and is used.
In this case, the electronic device is surface-mounted onto the mother printed circuit board
25
. More particularly, first the electronic device is put on a predetermined place of the mother printed circuit board
25
and thereafter a cream solder is applied to each corner portion between a conductive pattern
26
on the mother board
25
and the frame
21
of the electronic device.
Then, the mother board
25
and the electronic device are put on a belt (not shown) and are conveyed to a reflow treatment device to ensure soldering between the conductive pattern
26
on the mother board
25
and the frame
21
.
In the conventional electronic device, the frame
21
is mounted merely by being put on the mother board
25
, so at the time of surface mounting there is a fear that soldering may be done in a dislocated state of the electronic device from a predetermined position on the mother board due to vibration or shock. Therefore, the quality of the device may deteriorate.
Further, since soldering is performed at corner portions between the frame
21
and the mother board
25
, there arises the problem that at the time of surface mounting the solder spreads along the corner portions and hence becomes thinner, thus resulting in the soldering being not effected to a satisfactory extent.
SUMMARY OF THE INVENTION
According to the first means adopted by the present invention for solving the above-mentioned problems there is provided an electronic device comprising a metallic frame having side walls and leg portions projecting downward from the side walls and a printed circuit board having through portions, the through portions being each constituted of a through hole or cutout portion, and wherein the printed circuit board is put on the underside of the frame in a partially outwardly projected state of the printed circuit board from the side walls, and the leg portions of the frame are inserted into the through portions of the printed circuit board and are projected downward from the underside of the same board.
According to the second means for solution adopted by the invention, the leg portions are tightly fitted in the through portions.
According to the third means for solution adopted by the invention, the leg portions each have a tapered portion which is wider gradually from its base end portion toward its tip end portion.
According to the fourth means for solution adopted by the invention, the printed circuit board has gap portions contiguous to the through portions.
According to the fifth means for solution adopted by the invention, the gap portions are each adjacent to a side end portion of the printed circuit board and partially opened in the side end portion.
According to the sixth means for solution adopted by the invention, the printed circuit board has a conductive pattern in proximity to the leg portions.
REFERENCES:
patent: 3885173 (1975-05-01), Lee
patent: 4861941 (1989-08-01), Kubo et al.
patent: 5805423 (1998-09-01), Wever et al.
patent: 5978229 (1999-11-01), Kim
patent: 81 23 367.1 (1981-11-01), None
patent: 3922461 (1990-01-01), None
patent: 295 05 327 (1995-09-01), None
patent: 0 265 285 (1988-04-01), None
patent: Hei 5-206674 (1993-08-01), None
patent: Hei 8-181459 (1996-07-01), None
patent: WO 94/06268 (1994-03-01), None
Alps Electric Co. ,Ltd.
Brinks Hofer Gilson & Lione
Paladini Albert W.
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