Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-01-19
2008-08-19
Gandhi, Jayprakash N (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S689000, C361S695000, C361S704000, C361S709000, C361S700000, C165S104330, C165S185000, C454S184000
Reexamination Certificate
active
07414841
ABSTRACT:
A heat dissipation device in a computer enclosure includes a heat spreader (20) mounted on a CPU (12), a first heat sink (30), a cooling fan (40) coupled to the first heat sink, a second heat sink (50), a heat pipe (80) mounted on the heat spreader and thermally connected the first heat sink and the second heat sink, a system fan (60) attached to the second heat sink, and a fan duct (70) interconnected between the cooling fan and the second heat sink. The system fan is positioned adjacent to louvers of the computer enclosure. An airflow generated by the cooling fan and the system fan flows through the first heat sink, then the fan duct, the second heat sink, and finally the louvers to leave the computer enclosure.
REFERENCES:
patent: 5208730 (1993-05-01), Tracy
patent: 6625021 (2003-09-01), Lofland et al.
patent: 6791837 (2004-09-01), Chen et al.
patent: 6920044 (2005-07-01), Lin
patent: 6920045 (2005-07-01), Huang et al.
patent: 6940716 (2005-09-01), Korinsky et al.
patent: 6969234 (2005-11-01), Lin
patent: 7035102 (2006-04-01), Holmes et al.
patent: 7121327 (2006-10-01), Chen
patent: 7126819 (2006-10-01), Liang
patent: 7165604 (2007-01-01), Huang
patent: 7174951 (2007-02-01), Lin
patent: 7248476 (2007-07-01), Holmes et al.
patent: 7269012 (2007-09-01), Lee et al.
patent: 7286350 (2007-10-01), Lee et al.
patent: 2005/0087329 (2005-04-01), Zhang et al.
patent: 2005/0099774 (2005-05-01), Song
patent: 2005/0180102 (2005-08-01), Kim
patent: 2005/0195568 (2005-09-01), Shyr
patent: 2006/0023419 (2006-02-01), Kao et al.
patent: 2006/0164808 (2006-07-01), Stefanoski
patent: 1516273 (2004-07-01), None
Chen Chun-Chi
Liu Jin-Biao
Wung Shih-Hsun
Yu Guang
Zhou Da-Yuan
Foxconn Technology Co., Ltd.
Fu Zhun Precision Industry (Shen Zhen) Co. Ltd.
Gandhi Jayprakash N
Hoffberg Robert J
Hsu Winston
LandOfFree
Electronic cooling system having a ventilating duct does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronic cooling system having a ventilating duct, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic cooling system having a ventilating duct will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3995026