Electronic cooling chassis

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Patent

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Details

174 16R, 165 80, 361401, H05K 720

Patent

active

040272060

ABSTRACT:
Electronic apparatus employing components generating substantial amounts of heat to be dissipated, and particularly solid state components, is in the form of a subassembly that includes a heat sink comprised of a plate or block of metal having a high coefficient of heat conductivity, such as aluminum, to which one or more solid state components may be secured and which also mounts heat radiating fins. The subassembly is slidably supportable in a holder by means of ribs on the inner surfaces of the walls of the holder cooperating with notches in the sides of the heat sink plate, and the holder may be made of dielectric material to electrically isolate the heat sink from an apparatus housing and from other heat sink plates when two or more heat sinks are supported in a holder. A circuit board carrying circuitry associated with the solid state components may be secured directly to one or more of the heat sink subassemblies.
An alternate form of the present invention utilizes an extruded, thermally conductive heat radiator in thermal communication with a heat sink formed as a plate or block of metal having a high coefficient of heat conductivity. The heat sink plate is utilized for absorbing heat produced by electronic components mounted directly thereon and additionally is used to support a printed circuit board for carrying electronic components which do not require special heat dissipating radiators. This entire subassembly is mounted in an electronic chassis including a fan which directs a flow of air over the extruded heat radiator as well as the remaining electronic components mounted on the printed circuit board. The extruded heat radiator includes a flat base element and a plurality of radiating ribs extending normal to the flat base element. This flat base element provides an enlarged cross-sectional area for transfer of heat from the heat sink into the extruded radiator and may, in an alternate embodiment, provide a direct mounting base for semiconductor devices.

REFERENCES:
patent: 2945163 (1960-07-01), Kilby
patent: 3149265 (1964-09-01), Thorn
patent: 3261396 (1966-07-01), Trunk
patent: 3373318 (1968-03-01), Rogers
patent: 3462553 (1969-08-01), Spranger
patent: 3780798 (1973-12-01), Reimer
patent: 3833837 (1974-09-01), West
Integrated Circuit Package, Tiffany, IBM Tech. Discl. Bulletin, vol. 13, No. 1, June 1970, p. 58.

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