Electronic control enclosure

Details Electronic control enclosure Electronic control enclosure

2007-03-13

2007-03-13

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S715000, C361S719000, C174S016100

Reexamination Certificate

active

10968438

ABSTRACT:
The electronic control enclosure includes devices and methods for removing heat energy from the electronic components of an electronic control unit. The components are mounted to a substrate and are protectively housed in an interior chamber of an environmentally sealed enclosure housing. Electrical communication is established with the components via a header assembly that includes plug receptacles. To remove heat generated by the components from the enclosure housing, one or more heat sinks are disposed through the enclosure housing such that the heat sinks have an interior surface exposed to the interior chamber and an exterior surface exposed to the exterior of the enclosure housing. In other embodiments, the enclosure housing may be made of a heat conductive material and the heat sink is integral with the enclosure housing. In one aspect, a spring urges the components against the interior surface. In another aspect, the components are mounted to and directly contact the interior surface.

REFERENCES:
patent: 3818419 (1974-06-01), Crane
patent: 4047242 (1977-09-01), Jakob et al.
patent: 4298905 (1981-11-01), Bosler et al.
patent: 4442450 (1984-04-01), Lipschutz et al.
patent: 4521829 (1985-06-01), Wessely
patent: 4546407 (1985-10-01), Benenati
patent: 4707726 (1987-11-01), Tinder
patent: 4763225 (1988-08-01), Frenkel et al.
patent: 4785379 (1988-11-01), Goodrich
patent: 4853828 (1989-08-01), Penn
patent: 4853829 (1989-08-01), Buzzelli
patent: 4923179 (1990-05-01), Mikolajczak
patent: 4972294 (1990-11-01), Moses, Jr. et al.
patent: 4994937 (1991-02-01), Morrison
patent: 5031028 (1991-07-01), Galich et al.
patent: 5060112 (1991-10-01), Cocconi
patent: 5225965 (1993-07-01), Bailey et al.
patent: 5272593 (1993-12-01), Jakob et al.
patent: 5274193 (1993-12-01), Bailey et al.
patent: 5280410 (1994-01-01), Klinger et al.
patent: 5305215 (1994-04-01), Brekkestran et al.
patent: 5309979 (1994-05-01), Brauer
patent: 5327324 (1994-07-01), Roth
patent: 5402313 (1995-03-01), Casperson et al.
patent: 5406483 (1995-04-01), Kallis et al.
patent: 5450284 (1995-09-01), Wekell
patent: 5454767 (1995-10-01), Clausen et al.
patent: 5461541 (1995-10-01), Wentland et al.
patent: 5461542 (1995-10-01), Kosak et al.
patent: 5526232 (1996-06-01), Kolberg et al.
patent: 5526261 (1996-06-01), Kallis et al.
patent: 5778329 (1998-07-01), Officer et al.
patent: 5857054 (1999-01-01), Thomas et al.
patent: 6043981 (2000-03-01), Markow et al.
patent: 6055158 (2000-04-01), Pavlovic
patent: 6094349 (2000-07-01), Fassel et al.
patent: 6191943 (2001-02-01), Tracy
patent: 6205023 (2001-03-01), Moribe et al.
patent: 6222732 (2001-04-01), Jakob et al.
patent: 6341063 (2002-01-01), Kinoshita et al.
patent: 6515858 (2003-02-01), Rodriguez et al.
patent: 6515864 (2003-02-01), Wakabayashi et al.
patent: 6527422 (2003-03-01), Hutchison
patent: 6583986 (2003-06-01), Stori et al.
patent: 6678159 (2004-01-01), Barcley
patent: 6781840 (2004-08-01), Ikushima et al.
patent: 3440334 (1986-05-01), None
patent: 43 44 629 (1994-07-01), None
patent: 198 03 358 (1999-08-01), None
patent: 0 400 434 (1990-05-01), None
patent: 1 006 766 (1999-11-01), None
patent: 2741503 (1997-05-01), None
patent: 2831384 (2003-04-01), None
Product sheets entitled Electronic Packaging Capabilities by Deutsch Industrial Products, © 2001-2002.

Affiliated with

Also associated with

Rating

Electronic control enclosure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic control enclosure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic control enclosure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3790506