Electronic control board assembly including embedded lead frames

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

361796, 361743, 361736, 439 74, H01R 909, H01R 2368, H05K 114

Patent

active

056992351

ABSTRACT:
An electronic control board assembly has a large-current control unit and a small-current control unit connected to the large-current control unit. The large-current control unit has an insert-molded board with lead frames embedded therein. The insert-molded board has a first component mounting surface and a first component soldering surface facing away therefrom. A first group of components are mounted on the first component mounting surface and have leads extending through the insert-molded board and soldered to the lead frames. The small-current control unit has a printed wiring board which has a second component mounting surface and a second component soldering surface facing away therefrom. A second group of components are mounted on the second component mounting surface and have leads extending through the printed wiring board and soldered to interconnections patterned on the second component soldering surface. The lead frames have ends extending through the printed wiring board and soldered to the interconnections. The first component soldering surface and the second component soldering surface face outwardly.

REFERENCES:
patent: 3832603 (1974-08-01), Cray et al.
patent: 4858071 (1989-08-01), Manabe et al.
patent: 5134546 (1992-07-01), Izumi et al.
patent: 5253143 (1993-10-01), Klinger et al.
patent: 5501003 (1996-03-01), Bernstein

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