Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2001-12-17
2003-04-29
Paladini, Albert W. (Department: 2827)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S613000, C438S666000, C228S180220
Reexamination Certificate
active
06555415
ABSTRACT:
BACKGROUND OF THE INVENTION
Field of the Invention
The present invention relates to an electronic configuration with electrical contacts, at least on a first surface of the electronic configuration, which enable the electronic configuration to be electrically bonded. The electronic configuration may in this case take the form of an electronic component or a component carrier, for example.
Electrical bonding of these configurations, for example, by means of solder balls, contact pins, or directly soldered connections between the electronic configuration and a further configuration (for example between a component and a carrier on which the component is to be mounted) is problematic to the extent that thermal loading may cause different linear expansions of the electronic configurations. This results in mechanical stresses at the soldered connections between the electronic configurations (that is to say, for example, between the component carrier and the electronic component). Such stresses may also occur, however, as a result of other mechanical loads on the configurations. One consequence of these stresses is the risk of damage or destruction to the soldered connections between the electronic configurations.
It is known from the prior art, as disclosed by U.S. Pat. No. 5,685,885, to arrange electrical contacts on a flexible layer. However, this layer has proven to be insufficiently elastic to optimally absorb the mechanical stresses that occur. In addition, the production of components with the layer disclosed there is relatively complicated.
SUMMARY OF THE INVENTION
It is accordingly an object of the invention to provide an electronic configuration and a method for producing the electronic configuration which overcome the above-mentioned disadvantages of the prior art apparatus and methods of this general type.
In particular, it is an object of the invention to provide an electronic configuration and a method for producing the electronic configuration in which greater insensitivity to mechanical stresses is obtained in the region of the electrical contacts.
With the foregoing and other objects in view there is provided, in accordance with the invention, a method for producing an electronic configuration having a first surface with at least one electrical contact for bonding. The method includes steps of: providing an electronic configuration having a first surface; configuring at least one flexible elevation made of an insulating material on the first surface; providing the flexible elevation with at least one recess; at least partially covering a surface of the flexible elevation with an electrically conductive material to form an electrical contact; applying an insulating layer at least partially to the first surface; forming a structural feature in a region of the insulating layer; forming the structural feature as a feature selected from the group consisting of a depression formed in the region of the insulating layer and a roughened surface formed in the region of the insulating layer; providing the insulating layer with a metallization at least in the region of the structural feature; and forming a recess selected from the group consisting of a first recess running perpendicularly in relation to the first surface and a second recess running parallel in relation to the first surface. When selecting the first recess as the recess, the flexible elevation is configured over the structural feature. When selecting the second recess as the recess, the flexible elevation is configured directly alongside the structural feature. The method also includes steps of: performing the step of forming the recess by directing laser light towards the structural feature such that the structural feature performs an operation selected from the group consisting of focusing the laser light and scattering the laser light; and applying an electrically conductive material at least partially to the surface of the flexible elevation.
At least one flexible elevation made of an insulating material is provided on the first surface of the electronic configuration on which the electrical contacts of the configuration are arranged. At least one electrical contact is arranged on the flexible elevation and is in the form of an electrically conductive material that at least partially covers the surface of the flexible elevation. This consequently elastically attaches the electrical contacts on the electronic component, so that, under thermal or mechanical loading of the component, the corresponding stresses are absorbed by the flexible elevation. This is performed much better in the case of an elevation, as opposed to the prior art straight-extending layer, since the elevation has a greater freedom of movement and can therefore compensate for greater tolerances. The flexible elevation has a recess enabling the flexibility of the elevation to be further enhanced.
In principle, the entire flexible elevation may also be produced from a flexible and electrically conductive material, so that the conducting connection is not established by a separate conduction path of a different material, but by the flexible material itself. However, very specific materials are necessary to achieve this, restricting the selection of flexible materials and their composition. What is more, such materials are generally more resistive than a purely conductive material, which forms a conductive path. In the preferred solution, in which the electrically conductive material covers the surface of the flexible elevation, a separate optimization of the flexible characteristics and of the conduction characteristics of the elevation is consequently possible.
This configuration has special significance in the case of electronic components which have a size that may, for example, correspond largely to the size of the electronic circuit, or of the circuit chip of the component, such as chip-size components, for example. Particularly in this specific case, apart from the electronic circuit or the circuit chip, there are virtually no other housing elements that could absorb the stresses on the electronic component. In the case of such components, there is a particularly high risk that the electrical contacts will be damaged or destroyed. Particularly in such a case, the occurrence of excessive mechanical stresses can be avoided, and consequently the operational reliability of the component ensured, by a flexible elevation such as that proposed according to the invention. However, the inventive teaching may also be advantageously used in the case of any other electronic configurations.
The electrical contacts of the electronic component are consequently arranged on a flexible elevation that compensates for the mechanical stresses that occur. To establish a conducting connection to an electrical contact on an elevation, a conductive path can be arranged on the outer surface of the flexible elevation, that is to say outside the recess. As an alternative to the conductive path on the outer surface of the flexible elevation, a conductive path may also be arranged in the recess of the flexible elevation. The conducting connection is consequently routed over the inner surface of the flexible elevation, that is to say, over the surface formed by the recess.
An electronic circuit, which is connected in a conducting manner to the electronic contacts, may then be provided in the electronic configuration. The electronic circuit may, for example, directly adjoin the flexible elevation, but additional conductor runs may also be arranged between the flexible elevation and the electronic circuit, so that the flexible elevation can be arranged at a distance from the electronic circuit.
If further conductor runs are provided, for example, between an electronic circuit and the flexible elevation, they may be arranged on an insulating layer that at least partially covers the first surface of the electronic component, with the insulating layer adjoining the flexible elevation. This has the advantage that the conductor runs can be structured by indirect structuring,
Chambliss Alonzo
Greenberg Laurence A.
Infineon - Technologies AG
Mayback Gregory L.
Paladini Albert W.
LandOfFree
Electronic configuration with flexible bonding pads does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronic configuration with flexible bonding pads, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic configuration with flexible bonding pads will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3022151