Electronic components packaging structure

Details Electronic components packaging structure Electronic components packaging structure

2007-07-26

2009-10-13

Thompson, Jewel (Department: 2855)

Measuring and testing

Volume or rate of flow

Thermal type

Reexamination Certificate

active

07600422

ABSTRACT:
In a preferred embodiment, a thermal mass flow meter is provided with: a pipe arrangement that allows a fluid to flow therein, a chip-type heat-generating element that is anchored on the surface on the periphery of the pipe arrangement and used for heating the fluid in the pipe arrangement, and paired chip-type temperature sensors that are anchored at positions on the upstream side and the downstream side of the heat-generating element with the same distance apart therefrom, on the surface of the pipe arrangement, and formed as members separated from the heat-generating element. With respect to the heat-generating element and the paired temperature sensors, convex portions thereof on a side opposite to the side to be anchored onto the pipe arrangement are housed in a concave of a printed-circuit board, and terminals of the heat-generating element and the paired temperature sensors are connected to the wiring layer of the printed-circuit board, and subsequently secured to the printed-circuit board.

REFERENCES:
patent: 3825999 (1974-07-01), Rubey
patent: 4188653 (1980-02-01), Goepel
patent: 4700016 (1987-10-01), Hitchcock et al.
patent: 6428361 (2002-08-01), Imschweiler et al.
patent: 7104805 (2006-09-01), Hjort et al.
patent: 2009/0096460 (2009-04-01), Watanabe et al.
patent: 09-133563 (1997-05-01), None

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