Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent
1993-02-26
1994-08-09
Ryan, Patrick J.
Stock material or miscellaneous articles
Structurally defined web or sheet
Discontinuous or differential coating, impregnation or bond
428210, 4283124, 4283128, 4283179, 428546, B32B 900
Patent
active
053365470
ABSTRACT:
The present invention relates to an electronic components mounting/connecting package characterized by using bump electrodes to connect electronic components such as semiconductors and the like with patterning electrodes of a circuit board.
In order to prevent deterioration in connecting reliability due to deformation and the like of semiconductors and circuit boards, it is necessary to have some elasticity incorporated with bump electrodes. The composition of bump electrodes disclosed by the present invention is to have resin particles dispersed to high density in the metallic bump electrodes.
According to this composition, even when there are some variations of distribution in circuit board warp and bump electrode height, it has become possible to absorb the variations through elasticity presented by the bump electrodes and to perform a low strain connection with a resultant enhancement in connecting reliability at high temperature.
REFERENCES:
patent: 3642528 (1972-02-01), Kimura
patent: 3752702 (1973-08-01), Iizuka et al.
patent: 4564563 (1986-01-01), Martin et al.
patent: 4595606 (1986-06-01), St. John et al.
patent: 4701279 (1987-10-01), Kawaguchi et al.
patent: 5209967 (1993-05-01), Wright et al.
Hatada Kenzo
Kawakita Tetsuo
Yoshida Takayuki
Lee Kam F.
Matsushita Electric - Industrial Co., Ltd.
Ryan Patrick J.
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