Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent
1991-10-09
1995-08-01
Ryan, Patrick J.
Stock material or miscellaneous articles
Structurally defined web or sheet
Discontinuous or differential coating, impregnation or bond
428292, 428293, 428294, 428247, 428249, 428263, B32B 506
Patent
active
054379210
ABSTRACT:
A base material for mounting electronic components is provided which has a low density and a coefficient of thermal expansion close to that of aluminum and can be processed with ease. The base material essentially consists of aluminum or an aluminum alloy reinforced with carbon fibers with a volume fraction ranging from 0.15 to 0.55, the carbon fibers in the base material being arranged at random on a surface for mounting an electronic component and being arranged in layer in a direction vertical to the above-described surface.
REFERENCES:
patent: 3894677 (1975-07-01), La Iacona
"Metal Matrix Composites for Microwave Packaging Components", Electronic Packaging & Production, by C. Thaw et al, pp. 27-29, Aug., 1987.
1st International SAMPE Electronics Conference, Jun. 23-25, 1987, "Metal Matrix Composite Microwave Packaging Components", by C. Thaw et al, pp. 452-462.
3rd International SAMPE Electroncis Conference, Jun. 20-22, 1989, "New Approaches to Microwave Circuit Packaging Using Aluminum Metal-Matrix Composites", by John R. Tyler et al, pp. 1068-1077.
Fujihara Takeji
Ito Takefumi
Kogo Yasuo
Okumura Mitsuhiro
Yamashita Hirofumi
Mitsubishi Denki & Kabushiki Kaisha
Ryan Patrick J.
Weisberger Richard P.
LandOfFree
Electronic components mounting base material does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronic components mounting base material, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic components mounting base material will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-733044