Electronic components mounting adhesive and electronic...

Details Electronic components mounting adhesive and electronic... Electronic components mounting adhesive and electronic...

2007-09-13

2011-10-11

Lam, Cathy (Department: 1784)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

C428S3550EP, C257S789000, C257S793000, C174S259000

Reexamination Certificate

active

08034447

ABSTRACT:
The invention intends to provide an electronic component mounting adhesive that can inhibit cracks and peelings in an electronic component mounting structure obtained by joining electronic components each other from occurring and an electronic component mounting structure obtained by joining electronic components with such an electronic component mounting adhesive. In an electronic component mounting structure, a first circuit board and a second circuit board are bonded with an electronic component mounting adhesive. Here, the electronic component mounting adhesive is obtained by dispersing metal particles having the melting temperature Mp lower than the glass transition temperature Tg of a cured material of a thermosetting resin in the thermosetting resin.

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