Electronic components and method of fabricating the same

Details Electronic components and method of fabricating the same Electronic components and method of fabricating the same

2007-05-08

2007-05-08

Ghyka, Alexander (Department: 2812)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S484000, C257SE21309, C257SE21415

Reexamination Certificate

active

10421368

ABSTRACT:
A method is provided for fabricating integrated electronic components. According to the method, an initial structure is produced on the surface of a first substrate. This initial structure incorporates a defined pattern formed from volumes of differentiated materials. At least part of the initial substrate that includes the defined pattern is transferred onto a second substrate, preferably by inverting the first substrate against the second substrate and then removing the first substrate. An additional structure is then produced on the second substrate. This additional structure includes volumes of material placed in correspondence with some of the volumes of differentiated material of the defined pattern. The electronic components thus produced may have a suitable configuration in accordance with technological or geometrical constraints. In a preferred method, a selective treatment is applied to the transferred part of the initial structure, so as to make a distinction between the volumes of differentiated material of the pattern.

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