Electronic component with shielding and method for its...

Details Electronic component with shielding and method for its... Electronic component with shielding and method for its...

2006-05-16

2006-05-16

Pham, Hoai (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

C257S778000

Reexamination Certificate

active

07045881

ABSTRACT:
An electronic component with shielding is described. The component has a semiconductor chip with a semiconductor substrate. Disposed in a region of a rear side of the semiconductor substrate is an electrically conductive buried layer. The buried layer is connected via a ground lead, disposed within the semiconductor substrate, to a contact area and an external ground potential. Furthermore, the invention relates to a method for producing an electronic component of this type.

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patent: 4561932 (1985-12-01), Gris et al.
patent: 5283454 (1994-02-01), Cambou
patent: 5866943 (1999-02-01), Mertol
patent: 5962924 (1999-10-01), Wyland et al.
patent: 6092281 (2000-07-01), Glenn
patent: 6109530 (2000-08-01), Larson et al.
patent: 6317333 (2001-11-01), Baba
patent: 03093266 (1989-09-01), None
Search Report issued by the German Patent and Trademark Office on Jul. 4, 2001.

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