Electronic component with shield case

Details Electronic component with shield case Electronic component with shield case

2000-11-17

2004-02-03

Martin, David (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S818000, C361S800000, C361S801000, C174S050510, C174S050000, C174S051000

Reexamination Certificate

active

06687135

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an electronic component. In more detail, the present invention relates to an electronic component with a shield case for housing surface mounted components mounted on a substrate.
2. Description of the Related Art
Electronic components comprises an electronic component
60
with a shield case
65
for housing surface mounted components
64
as shown in FIG.
8
.
The electronic component with such shield case has been manufactured by the manufacturing method as described below:
(1) Through-holes
62
are formed on a sheet substrate (a mother substrate)
61
provided with a plurality of substrates
51
for mounting the components, and an electrode
63
for attaching the shield case is formed on an inner circumference face (side face) of each through hole
62
as shown in FIG.
9
.
(2) In the next step, the surface mounted component
64
is mounted on a sheet substrate (the mother substrate)
61
, and the surface mounted component
64
is soldered to land electrodes (not shown) of the sheet substrate
61
.
(3) Subsequently, a solder paste
67
is filled in the through holes
62
.
(4) Then, engaging pins
66
of a plurality of the shield cases
65
are inserted into the through holes
62
filled with the solder paste
67
.
(5) Then, a plurality of the shield cases
65
are soldered to the sheet substrate
61
by melting the solder in the solder paste
67
. The shield cases
65
are connected and fixed to the sheet substrate
61
as shown in
FIG. 8
by soldering the engaging pins
66
to the fixing electrodes (shield case attachment electrodes:
FIG. 9
)
63
in the through holes
62
.
(6) Finally, an individual electronic component
60
as shown in
FIG. 8
is obtained by cutting the sheet substrate
61
along the lines (cutting lines) A—A using a dicing machine.
The through hole
62
formed on the sheet substrate (mother substrate)
61
has a larger diameter than the width of the engaging pin
66
so that the engaging pin
66
can be easily inserted. Consequently, the shield case
65
is engaged with the through hole with a little gap (play) when the shield case
65
is attached to the sheet substrate
61
by inserting the engaging pin
66
into the through hole
62
in the step for preparing the sheet substrate
61
, thereby causing an improper alignment in the subsequent manufacturing step to adversely affect the configurational and dimensional accuracy, and shield characteristics.
Otherwise, the solder that serves for fixing the engaging pin
66
to a fixing electrode
63
of the through hole
62
re-melts in the reflow soldering step for mounting on the printed circuit board, and in the step for manufacturing the individual electronic component
60
(
FIG. 8
) obtained by cutting the sheet substrate
61
after soldering a plurality of the shield cases
65
on the sheet substrate
61
, arising a problem of positional shift of the shield cases
65
or falling of the shield cases
65
out of the substrate to make the component to go out of use.
SUMMARY OF THE INVENTION
Accordingly, the object of the present invention for solving-the problems as hitherto described is to provide an electronic component having high positional accuracy in attaching the shield case to the substrate and high shield performance as well as high mounting reliability.
The present invention for attaining the foregoing objects provides an electronic component with a shield case for housing surface mounted components on a substrate comprising: a substrate provided with engaging recesses for attaching a shield case at plural sites on the side face of the substrate; a surface mounted component mounted on the substrate; and a shield case having a main body covering the surface for mounting the surface mounted component of the substrate, and a plurality of engaging pins to be inserted into the engaging recesses of the substrate, the shield case being so configured as to be bent when predetermined engaging pins are engage with the substrate by inserting the engaging pins into the corresponding engaging recesses of the substrate, wherein the plural engaging pins on the shield case hold the substrate with enhanced elastic force.
The substrate can be securely held with a plurality of the engaging pins inserted into the engaging recess of the substrate by providing the engaging recess on the side face of the substrate and a plurality of the engaging pins on the shield case, the shield case being so configured as to be bent when given engaging pins engage with the substrate by inserting the engaging pins into designated engaging recesses of the substrate, wherein the plural engaging pins on the shield case hold the substrate with enhanced elastic force. Consequently, the shield case has a high positional accuracy for attaching to the substrate and an excellent shielding performance, thereby enabling an electronic component with a shield case with high reliability for mounting.
According to the present invention the configuration of the shield case that allows the shield case to be bent when the engaging pin is inserted into the engaging recess of the substrate as used in the electronic component having the shield case. The configuration of the shield case includes a wide range of concepts such as a configuration for allowing the engaging pin of the shield case to be deflected, a configuration for allowing the main body of the case to be deflected, or a configuration for allowing both of the engaging pin and the main body of the case to be deflected.
In the electronic component with the shield case according to the present invention, the main body of the case and the engaging pins can be made of the unitary member. Otherwise, separate main body of the case and engaging pins can be combined and integrated.
Preferably, a projection or a bending portion is provided on the engaging pin to be engaged with the engaging recess of the substrate.
Providing a projection or a bending portion on the engaging pin of the shield case allows the shield case to be securely connected to the substrate. Consequently, fixing strength of the shield case to the engaging recess of the substrate is improved, thereby positional accuracy of an electronic component for attaching the shield case to the substrate is improved. Further, shielding performance and reliability for mounting is improved.
Preferably, the engaging pins are protruded from the lower surface of the substrate, the shield case being fixed to the substrate by bending the protruding portions of the engaging pins from the lower surface of the substrate.
When the engaging pin is protruded from the lower face side of the substrate, and when the pin protruding from the lower face side of the substrate is bent, the shield case can be securely fixed to the substrate in the manufacturing step, enabling occurrence of positional shift of the shield case to be securely prevented.
In the electronic component with the shield case according to the present invention, preferably, a step portion is provided on the inner circumference of the engaging recess of the substrate, the step portion is engaged with the engaging pin of the shield case.
Forming a step portion for engaging with the engaging pin of the shield case allows reliability for engaging the engaging pin with the engaging recess to be improved. Accordingly reliability of positional accuracy for attaching the shield case to the substrate and shielding performance is further improved.
Preferably, a land electrode for electrical connection to the shield case is provided at the periphery of the engaging recess for mounting the surface mounted component on the substrate, the land electrode being connected to a part of the shield case with a solder.
Providing a land electrode for electrical connection to the shield case at the periphery of the engaging recess to connect a part of the shield case to the land electrode with a solder allows reliability of electrical connection to be improved.
Preferably, a solder plating or a tin plating for improving sold

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