Electronic component with lead terminals and method of manufactu

Metal fusion bonding – Process – With shaping

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2281736, 2281802, 29827, B23K 3102

Patent

active

047859903

ABSTRACT:
An electronic component with lead terminals, includes an electronic component element, electrodes respectively formed on opposite end faces of the electronic component element, and lead terminals respectively connected to the electrodes for electrical conduction, and each of the lead terminals having a large width portion formed at one end of its small width tip portion, and the large width portions of the lead terminals being conductively connected to the electrodes of the electronic component element. The disclosure is also directed to a method of manufacturing such electronic component.

REFERENCES:
patent: 3544857 (1970-12-01), Bynne et al.
patent: 3982317 (1976-09-01), Eysermans
patent: 4232815 (1980-11-01), Nakano et al.
patent: 4396140 (1983-08-01), Jaffe et al.

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