Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Reexamination Certificate
2007-12-25
2007-12-25
Zarneke, David A. (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Solder wettable contact, lead, or bond
C438S612000, C257SE23020, C257SE21511
Reexamination Certificate
active
10963434
ABSTRACT:
An electronic component has an electronic circuit and a rubber-elastic elevation. The rubber-elastic elevation is formed of an insulating rubber-elastic material disposed on a surface of the electronic component and has a conductive land on its crest. The rubber-elastic elevation also has on its sloping side or in its volume a conduction path between the land and the electronic circuit.
REFERENCES:
patent: 4001870 (1977-01-01), Saiki et al.
patent: 4074342 (1978-02-01), Honn et al.
patent: 4365264 (1982-12-01), Mukai et al.
patent: 4618878 (1986-10-01), Aoyama et al.
patent: 4740700 (1988-04-01), Shaham et al.
patent: 4813129 (1989-03-01), Karnezos
patent: 4885126 (1989-12-01), Polonio
patent: 4902606 (1990-02-01), Patraw
patent: 5072520 (1991-12-01), Nelson
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5148266 (1992-09-01), Khandros et al.
patent: 5180311 (1993-01-01), Schreiber et al.
patent: 5196371 (1993-03-01), Kulesza et al.
patent: 5420329 (1995-05-01), Zeiss
patent: 5455390 (1995-10-01), DiStefano et al.
patent: 5477087 (1995-12-01), Kawakita et al.
patent: 5489749 (1996-02-01), DiStefano et al.
patent: 5491302 (1996-02-01), DiStefano et al.
patent: 5508228 (1996-04-01), Nolan et al.
patent: 5604380 (1997-02-01), Nishimura et al.
patent: 5619017 (1997-04-01), Distefano et al.
patent: 5666270 (1997-09-01), Matsuda et al.
patent: 5679977 (1997-10-01), Khandros et al.
patent: 5685885 (1997-11-01), Khandros et al.
patent: 5749997 (1998-05-01), Tang et al.
patent: 5777379 (1998-07-01), Karavakis et al.
patent: 5783465 (1998-07-01), Canning et al.
patent: 5874782 (1999-02-01), Palagonia
patent: 5907785 (1999-05-01), Palagonia
patent: 6211572 (2001-04-01), Fjelstad et al.
patent: 6277669 (2001-08-01), King et al.
patent: 6284563 (2001-09-01), Fjelstad
patent: 6319564 (2001-11-01), Naundorf et al.
patent: 6396145 (2002-05-01), Nagai et al.
patent: 6433427 (2002-08-01), Wu et al.
patent: 6492200 (2002-12-01), Park et al.
patent: 6887777 (2005-05-01), Hedler
patent: 6897568 (2005-05-01), Haimerl et al.
patent: 6956287 (2005-10-01), Hedler et al.
patent: 7080988 (2006-07-01), Hedler et al.
patent: 2 301 083 (1999-12-01), None
patent: 196 39 934 (1998-04-01), None
patent: 0 930 641 (1999-07-01), None
patent: 61-242 041 (1986-10-01), None
patent: 01 192 125 (1989-08-01), None
patent: 01 281 792 (1989-11-01), None
patent: 3-231 437 (1991-10-01), None
patent: 04 280 458 (1992-10-01), None
patent: 04-280458 (1992-10-01), None
patent: 05-160536 (1993-06-01), None
patent: 5-182 972 (1993-07-01), None
patent: 05 243 231 (1993-09-01), None
patent: 5-251 455 (1993-09-01), None
patent: 05-243231 (1993-09-01), None
patent: 07-106756 (1995-04-01), None
patent: 08-269727 (1996-10-01), None
patent: 10-190218 (1998-07-01), None
patent: 10-197557 (1998-07-01), None
patent: 11-017050 (1999-01-01), None
patent: 11 168 122 (1999-06-01), None
patent: 11 251 378 (1999-09-01), None
patent: 11-330318 (1999-11-01), None
patent: 2000-068321 (2000-03-01), None
patent: 98/50950 (1998-11-01), None
patent: WO 98/52225 (1998-11-01), None
patent: WO 98/55669 (1998-12-01), None
patent: 99/05895 (1999-02-01), None
patent: 99/65075 (1999-12-01), None
patent: 00/79589 (2000-12-01), None
Beine, H.: “Polymer-Flip-Chip-Technologie” [Polymer-Flip-Chip-Technology], productronic, Jul. 1996, pp. 26-27.
Burggraaf, P.: “Chip Scale and Flip Chip: Attractive Solutions”, Solid State Technology, Jul. 1998, pp. 239-240, 242, 244, 246.
Anonymous: “Method of Testing Chips and Joining Chips to Substrates”,Chemical Abstracts XP-000169195, p. 130.
Haimerl Alfred
Hedler Harry
Pohl Jens
Greenberg Laurence A.
Infineon - Technologies AG
Locher Ralph E.
Stemer Werner H.
Zarneke David A.
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