Electronic component with a semiconductor chip and method of...

Details Electronic component with a semiconductor chip and method of... Electronic component with a semiconductor chip and method of...

2005-02-22

2005-02-22

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

C174S050510, C257S778000, C257S738000

Reexamination Certificate

active

06858799

ABSTRACT:
An electronic component includes a semiconductor chip that has an active upper side with integrated circuits and a passive rear side. The rear side and the side border regions of the semiconductor chip also form the outer package sides of the electronic component. At least the corner regions and the edge regions of the rear side and the side border regions of the semiconductor chip have a plastic coating with a thickness in the micrometer range. Furthermore, the invention relates to a method of producing such an electronic component.

REFERENCES:
patent: 5879964 (1999-03-01), Paik et al.
patent: 5956605 (1999-09-01), Akram et al.
patent: 6537482 (2003-03-01), Farnworth
patent: 197 28 992 (1999-01-01), None
patent: 10 316 955 (1998-12-01), None

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