Electronic component with a housing package

Details Electronic component with a housing package Electronic component with a housing package

2008-01-15

2008-01-15

Nasri, Javaid H. (Department: 2839)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

Reexamination Certificate

active

10519215

ABSTRACT:
The invention relates to an electronic component with a housing package comprising a number of layers of plastic with at least one buried interconnect layer and with at least one semiconductor chip, which has pointed-conical external contacts distributed on an outer side. The pointed-conical external contacts penetrate through one of the layers of plastic and form contact vias with respect to the buried interconnect layer. Furthermore, the invention relates to a method for producing such an electronic component.

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