Electronic component-use material and electronic component...

Details Electronic component-use material and electronic component... Electronic component-use material and electronic component...

2005-08-09

2005-08-09

Lam, Cathy F. (Department: 1775)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From phenol, phenol ether, or inorganic phenolate

C424S405000, C428S901000

Reexamination Certificate

active

06927272

ABSTRACT:
Material of electronics component and electronics components using the same material are provided. The material includes repellent that can withstand severe solder-mounting conditions, and the electronics components such as printed wiring boards can lasts repelling effect for a long period. The material is used in electronics components requiring a soldering process, and includes at least curable resin, filler and the repellent. The repellent has vapor pressure of less than 10,000 nPa at room temperature. Film is formed using the material at a given place of an electronics component such as a printed wiring board.

REFERENCES:
patent: 6387387 (2002-05-01), Haniu et al.
patent: 6403894 (2002-06-01), Iwasaki et al.
patent: 6475328 (2002-11-01), Haniu et al.
patent: 6477038 (2002-11-01), Iwasaki et al.
patent: 0 771 526 (1997-05-01), None
patent: 0 856 556 (1998-08-01), None
patent: 10-212207 (1998-08-01), None
patent: 2001-48706 (2001-02-01), None
Japanese Search Report for Application No. PCT/JP02/05397 dated Sep. 17, 2002.
English translation of PCT/ISA/210.

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