Electronic component unit and electronic apparatus

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S695000, C361S697000, C361S679490, C361S727000, C165S104330, C165S104340, C165S185000, C165S122000, C165S126000, C454S184000

Reexamination Certificate

active

07623346

ABSTRACT:
Airflow is introduced into an enclosure through an air inlet in an electronic component unit. The airflow runs toward a first electronic component. The airflow absorbs heat from the first electronic component. The first electronic component is thus sufficiently cooled. A second electronic component is mounted on a printed wiring board at a position remoter from the air inlet than the position of the first electronic component. An air intake opening is formed in the enclosure. The air intake opening is defined at a section of the enclosure opposed to the printed wiring board at least between the first and second electronic components. Airflow is introduced toward the second electronic component through the air intake opening. The second electronic opening is thus sufficiently cooled. In this manner, the first and second electronic components are cooled equally to the utmost.

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patent: 6504718 (2003-01-01), Wu
patent: 6556438 (2003-04-01), Bolognia et al.
patent: 6616248 (2003-09-01), Obuse et al.
patent: 6654244 (2003-11-01), Laufer et al.
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patent: 6980435 (2005-12-01), Shum et al.
patent: 6999312 (2006-02-01), Garnett et al.
patent: 7061761 (2006-06-01), Tucker et al.
patent: 7120018 (2006-10-01), Shen et al.
patent: 405029782 (1993-02-01), None

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