Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate
2001-12-27
2004-11-09
Wilczewski, M. (Department: 2822)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Subsequent separation into plural bodies
C438S460000, C438S613000, C438S614000, C438S113000
Reexamination Certificate
active
06815313
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates generally to an electronic component having an electronic circuit device sealed therein and a method of manufacturing the same, and, more particularly, to an electronic component to be mounted on a circuit board and having a surface acoustic wave device or a semiconductor integrated circuit device sealed therein, as well as to a method of manufacturing the same.
2. Description of the Related Arts
Electronic appliances use a multiplicity of electronic components in each of which is hermetically sealed an electronic circuit device such as a semiconductor integrated circuit device or a surface acoustic wave (hereinafter, referred to as SAW) device. Such a multiplicity of electronic components are mounted on a single circuit board. Recent electronic appliances have a tendency toward miniaturization and low prices. This necessitates miniaturized and low-priced electronic components for use therein. Prevailing electronic components often employ a typical structure in which the electronic circuit device is sealed in a ceramic or metal package. However, in order to achieve further miniaturization and low prices there have been proposed electronic components making use of substrates themselves formed with electronic circuit devices for sealing of the electronic circuit devices.
Referring to
FIGS. 20A and 20B
, an electronic component is shown having a structure that is disclosed in “Optimizing AQP SAW Resonators for Reduced Vibration Sensitivity” published in IEEE Ultrasonic Symposium, 1995.
FIG. 20A
is a side elevation of an electronic component
110
; and
FIG. 20B
is a sectional view of the same taken along a line A—A of FIG.
20
A. The electronic component
110
is an SAW resonator. The SAW resonator includes comb-shaped electrodes
116
,
118
,
120
and
122
that are formed on a main surface
114
of an SAW substrate
112
. A glass sealing wall
126
is formed on a quartz substrate
124
and is fused to the main surface
114
of the SAW substrate
112
. The sealing wall
126
is formed so as to enclose an SAW device formed on the SAW substrate
112
. The SAW device is hermetically sealed by the SAW substrate
112
, quartz substrate
124
and sealing wall
126
. The comb-shaped electrodes
116
,
118
,
120
and
122
extend beyond the sealing wall
126
so that their extremities, i.e., electrodes pads
128
,
130
,
132
and
134
are connected via bonding wires not shown to a circuit board not shown. In the step of assembling such two substrates into the electronic component
110
, the assembly is typically carried out for each electronic component.
When fabricating the electronic component
110
depicted in
FIGS. 20A and 20B
, the sealing wall
126
may be heated upon fusing of the sealing wall
126
made of glass, polyimide resin or epoxy resin onto the main surface
114
of the SAW substrate
112
, with the result that gas may be generated at the sealing wall fused portion. The thus generated gas may possibly attach to the SAW device electrodes inside the sealing wall, resulting in degradation of the SAW device characteristics.
SUMMARY OF THE INVENTION
The present invention was conceived in order to overcome the above problems. It is therefore the object of the present invention to provide an electronic component having a structure capable of effective removal of gas that may be generated upon the fusion of sealing walls.
According to a first aspect of the present invention there is provided an electronic component to be mounted a circuit board comprising a first substrate having an electronic circuit device and an electrode pad on one main surface of the first substrate in electric connection with the electronic circuit device; a sealing wall whose one face is closely adhered to the one main surface of the first substrate, the sealing wall being configured to enclose the electronic circuit device with the electrode pad arranged outside of the sealing wall; a second substrate closely adhered to the other face of the sealing wall; an opening formed in the second substrate at a site confronting the electrode pad; and an electrically conductive member extending through the interior of the opening for electrical connection with the electrode pad.
In the electronic component of the present invention, the electrically conductive member may comprise a bump disposed on the electrode pad.
In the electronic component of the present invention, the electrically conductive member may comprise a first bump disposed on the electrode pad for electrical connection with the electrode pad; and a second bump disposed on top of the first bump for electrical and physical connection with the circuit board.
In the electronic component of the present invention, the electrically conductive member may comprise a first bump disposed on the electrode pad for electrical connection with the electrode pad; and a second bump disposed on top of the first bump for electrical and physical connection with the circuit board; the first bump being a gold bump, the second bump being a solder bump.
In the electronic component of the present invention, the second substrate may have a second sealing wall around the opening configured to enclose the electrically conductive member.
In the electronic component of the present invention, the electrically conductive member may comprise a first electrically conductive member disposed on an inner wall of the opening for being electrically and physically connectable to the circuit board; and a second electrically conductive member disposed on the electrode pad for being electrically connected with the first electrically conductive member and with the electrode pad.
In the electronic component of the present invention, the electrically conductive member may comprise a first electrically conductive member disposed on an inner wall of the opening for being electrically and physically connectable to the circuit board; and a second electrically conductive member disposed on the electrode pad for being electrically connected to the first electrically conductive member and to the electrode pad. The second substrate may be a multi-layer substrate carrying one or more circuit elements thereon. In this case, the circuit element can be an element such as an inductor, a capacitor or a resistor having certain electrical characteristics and capable of being connected to other elements to form a circuit. The multi-layer substrate can be, for example, one having a structure in which a plurality of insulating layers and electrically conducting layers are disposed one on top of the other.
In the electronic component of the present invention, the sealing wall may be made of an insulating material, the material having an adhesion to at least one of the first substrate and the second substrate. The sealing wall may be made of a material selected from a group consisting of glass, polyimide resin and epoxy resin.
In the electronic component of the present invention, the electronic circuit device may be a surface acoustic wave device.
In the electronic component of the present invention, the first and second substrates may be made of the same material.
According to a second aspect of the present invention there is provided a method of manufacturing an electronic component, the electronic component to be mounted on a circuit board comprising a first substrate having on its one main surface an electronic circuit device and an electrode pad in electric connection with the electronic circuit device; a sealing wall whose one face is closely adhered to the one main surface of the first substrate, the sealing wall being configured to enclose the electronic circuit device with the electrode pad arranged outside of the sealing wall; a second substrate closely adhered to the other face of the sealing wall; an opening formed in the second substrate at a site confronting the electrode pad; and an electrically conductive member extending through the interior of the opening for allowing the electrode pad and the circuit subst
Gauthier & Connors LLP
Japan Radio Co. Ltd.
Wilczewski M.
LandOfFree
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