Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2006-09-19
2006-09-19
Nguyen, Vinh P. (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S765010, C324S761010
Reexamination Certificate
active
07109732
ABSTRACT:
A test apparatus and method in which a compressible housing is used to retain an electronic component having conductors thereon. The compressible housing is lowered onto a suitable base member having upstanding probes which are also compressible and which physically engage respective ones of the conductors at one end thereof and an appropriate conductor (e.g., conductive pads on a printed circuit board) on the other when the test apparatus is fully assembled and testing occurs.
REFERENCES:
patent: 4105970 (1978-08-01), Katz
patent: 4686464 (1987-08-01), Elsässer et al.
patent: 4851765 (1989-07-01), Driller et al.
patent: 4885533 (1989-12-01), Coe
patent: 4937707 (1990-06-01), McBride et al.
patent: 5032787 (1991-07-01), Johnston et al.
patent: 5057969 (1991-10-01), Ameen et al.
patent: 5159535 (1992-10-01), Desai et al.
patent: 5204615 (1993-04-01), Richards et al.
patent: 5391995 (1995-02-01), Johnston et al.
patent: 5435732 (1995-07-01), Angulas et al.
patent: 5453701 (1995-09-01), Jensen et al.
patent: 5500605 (1996-03-01), Chang
patent: 5519936 (1996-05-01), Andros et al.
patent: 5804984 (1998-09-01), Alcoe et al.
patent: 6037785 (2000-03-01), Higgins
patent: 6046597 (2000-04-01), Barabi
patent: 6051982 (2000-04-01), Alcoe et al.
patent: 6208155 (2001-03-01), Barabi et al.
patent: 6270356 (2001-08-01), Hoshino et al.
patent: 6292007 (2001-09-01), Potter
IBM Technical Disclosure Bulletin, vol. 25, No. 11B, Apr. 1983, pp. 6265-6266, “Spring Loaded Probe with Rotational Wiping Feature”.
IBM Technical Disclosure Bulletin, vol. 37, No. 02B, Feb. 1994, pp. 603-604, “Tini-Probe Interposer Connector”.
Endicott Interconnect Technologies, Inc.
Fraley Lawrence R.
Hinman, Howard & Kattell LLP
Nguyen Vinh P.
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