Electronic component taking out apparatus

Details Electronic component taking out apparatus Electronic component taking out apparatus

2011-04-05

2011-04-05

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S712000, C029S721000, C029S740000, C356S614000, C414S730000

Reexamination Certificate

active

07918017

ABSTRACT:
A plurality of reference electronic components (M1, M2) marked in advance are identified and recognized, and the positions of the plurality of the reference electronic components (M1, M2) positioned in the vicinity of an electronic component to be taken out (2a) and component arrangement information in a wafer mapping file (MF) stored in a storage device (11f) are used to calculate the position of the electronic component to be taken out (2a).

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