Electronic component structure and method of making

Details Electronic component structure and method of making Electronic component structure and method of making

2011-01-11

2011-01-11

Mulpuri, Savitri (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S067000, C438S107000, C257SE21499, C257SE33057

Reexamination Certificate

active

07867806

ABSTRACT:
An external component, typically a surface mount passive, is attached to a semiconductor die. In some embodiments the passive is placed directly over exposed pads on the semiconductor die and attached using conductive tape or conductive epoxy. In some embodiments the passive is attached to the semiconductor die using non-conductive adhesive and wire bonded to bond pads on the semiconductor die and/or to pads on a substrate to which the semiconductor die is attached.

REFERENCES:
patent: 5608237 (1997-03-01), Aizawa et al.
patent: 5767564 (1998-06-01), Kunimatsu et al.
patent: 6611434 (2003-08-01), Lo et al.
patent: 6873228 (2005-03-01), Barratt
patent: 2003/0203537 (2003-10-01), Koopmans
patent: 2004/0245649 (2004-12-01), Imaoka
patent: 2004/0257780 (2004-12-01), Hester et al.
patent: 2005/0173783 (2005-08-01), Chow et al.
patent: 2006/0094160 (2006-05-01), Akram
patent: 2006/0246622 (2006-11-01), Kim et al.

Affiliated with

Also associated with

Rating

Electronic component structure and method of making does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic component structure and method of making, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic component structure and method of making will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2655782