Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate
2007-10-29
2009-02-03
Mandala, Victor A (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
C257S758000, C257S773000, C257SE23043, C257SE23045, C257SE23047
Reexamination Certificate
active
07485973
ABSTRACT:
The present invention is a semiconductor device capable of relieving thermal stress without breaking wire. It comprises a semiconductor chip, a solder ball for external connection, wiring for electrically connecting the semiconductor chip and the solder ball, a stress relieving layer provided on the semiconductor chip, and a stress transmission portion for transmitting stress from the solder ball to the stress relieving layer in a peripheral position of an electrical connection portion of the solder ball and wiring.
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Mandala Victor A
Oliff & Berridg,e PLC
Seiko Epson Corporation
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