Electronic component, semiconductor device employing same,...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

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C438S612000, C257SE21169

Reexamination Certificate

active

07728431

ABSTRACT:
Herein disclosed an electronic component having a passivation layer in which an opening that exposes a part of a pad electrode is formed, an underlying metal layer formed on the pad electrode and the passivation layer, and a barrier metal layer formed on the underlying metal layer for an external connection electrode, the electronic component including a recess or/and a projection configured to be provided under the barrier metal layer outside or/and inside the opening, the underlying metal layer being formed on the recess or/and the projection and having a surface shape that follows the recess or/and the projection.

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patent: 5298459 (1994-03-01), Arikawa et al.
patent: 7176583 (2007-02-01), Daubenspeck et al.
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patent: 10-189635 (1998-07-01), None
patent: HEI10-189606 (1998-07-01), None
patent: 10-247651 (1998-09-01), None
patent: HEI10-247651 (1998-09-01), None
patent: 2004-228295 (2004-08-01), None
patent: 2004-349536 (2004-12-01), None
patent: 2005-116885 (2005-04-01), None
patent: 2005-183641 (2005-07-01), None
patent: 2005-322705 (2005-11-01), None

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