Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2011-04-26
2011-04-26
Dang, Phuc T (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S698000, C257S704000, C438S051000, C438S114000
Reexamination Certificate
active
07932594
ABSTRACT:
An electronic component sealing substrate capable of configuring an electronic apparatus in which the influence of electromagnetic coupling and radio frequency noises between an electrical connection path and a micro electronic mechanical system is suppressed is provided. An electronic component sealing substrate (4) for hermetically sealing a micro electronic mechanical system (4) of an electronic component (2) that includes a semiconductor substrate (5), the micro electronic mechanical system (3) formed on a main face of the semiconductor substrate (5), and an electrode (6) electrically connected to the micro electronic mechanical system (3), includes an insulating substrate (7) that has a first main face joined to the main face of the semiconductor substrate (5) so as to hermetically seal the micro electronic mechanical system (3), and a wiring conductor (8) that has an end extending to the first main face of the insulating substrate (7) and is electrically connected to the electrode (6) of the electronic component (2), and the end of the wiring conductor (8) is positioned outside a joined portion of the main face of the semiconductor substrate (5) and the first main face of the insulating substrate (7).
REFERENCES:
patent: 4574255 (1986-03-01), Fujii et al.
patent: 5172304 (1992-12-01), Ozawa et al.
patent: 5652466 (1997-07-01), Hirakawa et al.
patent: 6841885 (2005-01-01), Hosoi et al.
patent: 2005/0167795 (2005-08-01), Higashi
patent: 2007/0040281 (2007-02-01), Nakayama et al.
patent: 59172807 (1984-09-01), None
patent: 02121392 (1990-05-01), None
patent: 04-293310 (1992-10-01), None
patent: 05007063 (1993-01-01), None
patent: 05-090882 (1993-04-01), None
patent: 09-219423 (1997-08-01), None
patent: 2004-209585 (2004-07-01), None
patent: 2005-072419 (2005-03-01), None
patent: 2005-072420 (2005-03-01), None
Maeda Toshihiko
Makinouchi Kouzou
Yoshida Katsuyuki
Dang Phuc T
DLA Piper (LLP) US
Kyocera Corporation
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