Electronic component sealing filler

Details Electronic component sealing filler Electronic component sealing filler

1992-06-12

1994-04-19

Bell, Mark L.

Compositions: coating or plastic

Materials or ingredients

Pigment, filler, or aggregate compositions, e.g., stone,...

10628734, 106481, 428404, C04B 1404

Patent

active

053042417

ABSTRACT:
A filler to be dispersed, as an inorganic material, in a thermosetting resin to produce an electronic component sealing agent, is composed of crystalline silicon dioxide particles. Not less than 70 wt-% of the crystalline silicon dioxide particles have the major-to-minor-axis ratio in the range of 1.20-1.40 and the circularity in the range of 0.75-0.90.

REFERENCES:
patent: 4677026 (1987-06-01), Hamamoto et al.
patent: 4792358 (1988-12-01), Kimura et al.
patent: 4814018 (1989-03-01), Tsurumaru et al.
patent: 4892591 (1990-01-01), Ogawa et al.
patent: 4923912 (1990-05-01), Sasaki et al.
World Patent Index Latest: AN: 87-338567/48 zu J 62 24 36 30-A, Oct. 24, 1987 Inorganic filler for resin composition.
World Patent Index Latest: AN: 85-16 29 82/27 zu J 60 09 44 55-A, May 27, 1985 Polyepoxide Polyester Polyphenol Melamine Polyimide Silicone.

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