Metal working – Means to assemble or disassemble – Means to assemble electrical device
Reexamination Certificate
1999-03-05
2001-03-06
Young, Lee (Department: 3729)
Metal working
Means to assemble or disassemble
Means to assemble electrical device
C029S809000, C029S040000, C029S03300H, C414S222090
Reexamination Certificate
active
06195876
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an electronic component placing apparatus for placing electronic components on a target object such as a substrate or component packaging tape.
2. Description of the Related Art
In Japanese Patent Application Laid-Open No. Hei 5-304392, there is disclosed an apparatus for loading electronic components on a substrate. This apparatus comprises a component supplying unit constituted by arranging a plurality of component cassettes in a line, and an index table having a plurality of suction nozzles on the outer periphery.
When loading electronic components on a substrate on a XY table, the component supplying unit is first moved so that a predetermined component cassette comes at a component taking-out position. Next, the suction nozzle, which is at a component taking-out position on the index table, is lowered, and the electronic component is taken out by sucking the electronic component from the component cassette. Then, the index table is rotated in a predetermined direction to move the suction nozzle which sucks the electronic component to a component loading position. Then, the XY table is moved in order to move a component loading point of the substrate to the component loading position. Then, the suction nozzle, which is located at the component loading position, is lowered, and the electronic component sucked by the suction nozzle is loaded on the substrate.
In the foregoing apparatus, time required to load one electronic component on the substrate becomes a sum of time for moving the component supplying unit so that a predetermined component cassette comes at the component taking-out position, time for taking out the electronic component from this component cassette, time for moving the electronic component taken out to the component loading position, and time for loading the electronic component moved to the component loading position on the substrate. Also, since a plurality of electronic components are loaded on one substrate, time required for loading predetermined numbers and types of electronic components on the substrate becomes a number obtained by multiplying the foregoing sum of time by the number of the components loaded.
In recent years, along with the miniaturization of electronic components, the number of components loaded on one substrate tends to increase, and the productivity improvements by high-speed loading are desired. In the foregoing apparatus, however, there is a limit in the mechanism on shortening the respective time required for loading one electronic component on a substrate, and therefore, it is difficult to satisfactorily meet the foregoing request.
SUMMARY OF THE INVENTION
An object of the present invention is to provide an electronic component loading apparatus capable of executing an operation of placing electronic components on a target object such as a substrate at high speed.
In order to achieve this object, an electronic component placing apparatus according to the present invention comprises a magazine having a housing passage for housing a plurality of electronic components in a lined-up state so as to be able to move by its own weight, a discharge port for discharging a lead electronic component within the housing passage, and an insertion opening into which a discharging tool for discharging the lead electronic component is inserted; a head which the magazines are detachably mounted; and at least one discharging tool which can be inserted into the insertion opening of the magazine mounted on the head, and an actuator for moving the discharging tool; the discharging tool being selectively inserted into the insertion openings of the magazines mounted on the head to thereby push out the electronic component from the discharge port of the magazine for loading it on an object.
According to this apparatus of the present invention, by an operation of inserting the discharging tool into the insertion opening of the magazine, the electronic component can be pushed out from the magazine discharge port to place the electronic component pushed out on the target object. Since a plurality of magazines are mounted to the head, by the operation of selectively inserting the discharging tool into the magazine insertion openings, it is possible to place a desired electronic component on the object, and to repeatedly perform this component arranging until the housed components are exhausted. Thus, in the operation of placing electronic components on the object, for example, an operation of loading predetermined numbers and types of electronic components on a substrate and the like, the productivity can be remarkably improved by performing the operations at high speed.
The foregoing and other objects, features and advantages of the present invention will be apparent from the following description and the accompanying drawings.
REFERENCES:
patent: 5516251 (1996-05-01), Ichikawa
patent: 5649356 (1997-07-01), Gieskes
patent: 5796616 (1998-08-01), Hamuro et al.
patent: 5-304392 (1993-11-01), None
Aoki Masaru
Fukai Kikuji
Koyama Kazushige
Murase Kiyoshi
Saito Koji
Lowe Hauptman & Gilman & Berner LLP
Taiyo Yuden Co. Ltd.
Tugbang A. Dexter
Young Lee
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