Electronic component placement method

Details Electronic component placement method Electronic component placement method

2006-08-16

2011-11-01

Banks, Derris (Department: 3729)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S740000, C029S830000, C029S831000, C029S832000, C029S833000

Reexamination Certificate

active

08046907

ABSTRACT:
In an electronic component placement method in which electronic components are picked up from a plurality of component supply sections which supply electronic components using a plurality of mounting heads which are provided corresponding to the respective component supply sections, and the electronic components are transferred and mounted on a substrate in a same placing stage, in performing the component transferring and mounting operations, head interference areas which constitute exclusive operating regions to which only the specified mounting heads are allowed to access are set for every placing turn. Due to such a constitution, in the component placement operation, it is possible to rationally set the accessible region without causing the interference of one mounting head with another mounting head thus shortening a placing tact time by excluding wasteful standby times of the mounting heads.

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International Search Report Dated Nov. 23, 2006.

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