Electronic component package comprising a moisture-retention ele

Details Electronic component package comprising a moisture-retention ele Electronic component package comprising a moisture-retention ele

1983-12-23

1985-11-12

Envall, Jr., Roy N.

Electric heating

Heating devices

Combined with diverse-type art device

357 78, H01L 2326, H05B 100

Patent

active

045530203

ABSTRACT:
A hermetically sealed encapsulation package for electronic components and integrated or hybrid electronic circuits has a base on which the component or circuit is mounted in the conventional manner and a cover. In one embodiment, the base includes a layer of a material which is able to retain any water molecules which might remain within the package after sealing or which may result from in-leakage from the surrounding atmosphere.

REFERENCES:
patent: 2127121 (1938-08-01), Kelley
patent: 2469435 (1949-05-01), Hirsch
patent: 2882244 (1959-04-01), Milton
patent: 3304623 (1967-02-01), Reiss
patent: 3391517 (1968-07-01), Lentz
patent: 3586926 (1971-06-01), Nakamura
patent: 4310781 (1982-01-01), Steinhage
patent: 4357557 (1982-11-01), Inohara
patent: 4426769 (1984-01-01), Grabbe
IBM Technical Disclosure Bulletin, vol. 17, No. 10, Mar. 1975, (New York, US), L. S. Goldmann, "Getter to Prevent Corrosion", p. 2879.

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