Electronic component package

Details Electronic component package Electronic component package

2007-10-19

2011-12-13

Ngo, Hung (Department: 2835)

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

C174S564000

Reexamination Certificate

active

08076576

ABSTRACT:
There is provided an electronic component package, in which electronic component element is mounted on a metal base, the electronic component element is covered by placing a metal cap over the metal base, and the metal base and the metal cap are joined by resistance welding to hermetically seal the electronic component element. With this electronic component package, a protrusion is provided to a portion of the metal base that comes into contact with the metal cap, and a projection tip of the protrusion has a flat face. Alternatively, the protrusion has a cross sectional shape that combines an arc member with the top side of an isosceles trapezoid.

REFERENCES:
patent: 3857993 (1974-12-01), Gregory
patent: 4888449 (1989-12-01), Crane et al.
patent: 6229088 (2001-05-01), Launtz
patent: 7745725 (2010-06-01), Paterek et al.
patent: 7755189 (2010-07-01), Nishiyama
patent: 04-004982 (1992-01-01), None
patent: 05-037280 (1993-02-01), None
patent: 2002-011579 (2002-01-01), None

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