Electronic component package

Details Electronic component package Electronic component package

2006-10-30

2009-11-24

Ngo, Hung V (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

With electrical device

C174S521000, C257S787000

Reexamination Certificate

active

07622684

ABSTRACT:
An electronic component package comprises: an electronic component where device elements are mounted inside cavities formed between a component substrate and a component cover that covers the component substrate; and a mounting substrate. The component cover is placed on the mounting substrate, and the electronic component is mounted on the mounting substrate and molded by a resin. At least one of a ground electrode and a dummy electrode is provided on a surface of the component cover, the surface being placed on the mounting substrate. At least one of the ground electrode and the dummy electrode is provided in a position opposed to at least part of the cavities.

REFERENCES:
patent: 5798557 (1998-08-01), Salatino et al.
patent: 5915168 (1999-06-01), Salatino et al.
patent: 5918112 (1999-06-01), Shah et al.
patent: 6448635 (2002-09-01), Glenn
patent: 6504096 (2003-01-01), Okubora
patent: 6649446 (2003-11-01), Goetz et al.
patent: 7042056 (2006-05-01), Koshido
patent: 7129576 (2006-10-01), Humpston
patent: 7231712 (2007-06-01), Saito et al.
patent: 2002/0074146 (2002-06-01), Okubora
patent: 2005/0067177 (2005-03-01), Saito et al.
patent: 2000-261284 (2000-09-01), None
patent: 2001-244785 (2001-09-01), None
patent: 2002-198744 (2002-07-01), None
patent: 2002-198774 (2002-07-01), None
patent: 2002-217673 (2002-08-01), None
patent: 2003-110391 (2003-04-01), None
patent: 2004-110391 (2003-04-01), None
patent: 2004-129222 (2004-04-01), None
patent: 2005-285864 (2005-10-01), None
International Search Report (PCT/JP2006/321639) dated Jan. 23, 2007.

Affiliated with

Also associated with

Rating

Electronic component package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic component package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic component package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4091378