Electronic component package

Details Electronic component package Electronic component package

2005-04-19

2005-04-19

Zarabian, Amir (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S123000, C438S124000, C438S127000

Reexamination Certificate

active

06881613

ABSTRACT:
An electronic component package and method of fabrication is provided. The electronic component package includes a ceramic substrate and a plurality of bonding pads formed on the substrate, each pad forming an interface with the ceramic. Formed on the bonding pads is a bonding material, and a plurality of electrical leads are secured to corresponding pads by the bonding material. A layer of adhesive is formed over at least the interfaces between the pads and ceramic.

REFERENCES:
patent: 5569958 (1996-10-01), Bloom
patent: 5959354 (1999-09-01), Smith et al.
patent: 6209352 (2001-04-01), Beall et al.
patent: 6335548 (2002-01-01), Roberts et al.
patent: 6384473 (2002-05-01), Peterson et al.
patent: 20020132463 (2002-09-01), Urushima

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