Electronic component mounting system and electronic...

Details Electronic component mounting system and electronic... Electronic component mounting system and electronic...

2008-05-20

2010-11-30

Banks, Derris H (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S739000, C029S740000, C029S743000, C029S833000, C029S860000

Reexamination Certificate

active

07841079

ABSTRACT:
In electronic component mounting for a plurality of individual substrates held on a carrier, solder position deviation data is calculated for each individual substrate based on a mark position recognition result on a carrier after solder printing, a solder position recognition result, and electrode position information indicating the position of an electrode on each individual substrate, an operation of calculating position correction data, which is used to correct the positional deviation to mount electronic components at proper positions, is performed for each individual substrate based on the calculated solder position deviation data and the calculated position correction data is feed-forwarded to an electronic component mounting apparatus, and an electronic component mounting operation of a component mounting mechanism is controlled based on the mark position recognition result and the position correction data.

REFERENCES:
patent: 5555316 (1996-09-01), Tsujikawa et al.
patent: 6216341 (2001-04-01), Nakahara
patent: 6904672 (2005-06-01), Nagafuku et al.
patent: 06-112295 (1994-04-01), None
patent: 09-097971 (1997-04-01), None
patent: 2002-271096 (2002-09-01), None
patent: 2006-019554 (2006-01-01), None
Japanese Office Action.

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