Electronic component mounting structure

Details Electronic component mounting structure Electronic component mounting structure

2008-06-12

2010-06-08

Lee, Jinhee J (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C174S262000, C174S264000, C361S758000

Reexamination Certificate

active

07733664

ABSTRACT:
An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.

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Office Action dated Jun. 3, 2009 from Europe Patent Office in the corresponding EP Application No. 07002961.6 (and English Translation).

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