Electronic component mounting method and apparatus

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S832000, C029S840000

Reexamination Certificate

active

10214357

ABSTRACT:
All images of a plurality of sucked and held electronic components are picked up, sucked and held states of the electronic components are successively recognized by their respective images in an order of placing the electronic components onto a circuit board, and the electronic components for which such recognition processing is completed can be successively placed onto the circuit board in this order during a process of the recognition processing.

REFERENCES:
patent: 2115559 (1938-04-01), Odartchenko
patent: 5864944 (1999-02-01), Kashiwagi et al.
patent: 6010709 (2000-01-01), Nichols
patent: 6044169 (2000-03-01), Hirotani et al.
patent: 6356352 (2002-03-01), Sumi et al.
patent: 6446333 (2002-09-01), Kashiwagi et al.
patent: 6606790 (2003-08-01), Hidese
patent: 6718630 (2004-04-01), Hada et al.
patent: 1283080 (2001-02-01), None
patent: 07-307598 (1995-11-01), None
patent: 2863731 (1998-12-01), None

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