Electronic component mounting method and apparatus

Details Electronic component mounting method and apparatus Electronic component mounting method and apparatus

2011-08-30

2011-08-30

Goff, II, John L (Department: 1746)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C029S832000

Reexamination Certificate

active

08007627

ABSTRACT:
A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip is corrected and the board is connected, the bumps are compressed, and the insulating resin is hardened.

REFERENCES:
patent: 4811081 (1989-03-01), Lyden
patent: 5407864 (1995-04-01), Kim
patent: 5603158 (1997-02-01), Murata et al.
patent: 5629566 (1997-05-01), Doi et al.
patent: 5686703 (1997-11-01), Yamaguchi
patent: 5834101 (1998-11-01), Hayashi
patent: 5895976 (1999-04-01), Morrell et al.
patent: 5918113 (1999-06-01), Higashi et al.
patent: 6049038 (2000-04-01), Suzuki
patent: 6112969 (2000-09-01), Horibe et al.
patent: 6207549 (2001-03-01), Higashi et al.
patent: 6223429 (2001-05-01), Kaneda et al.
patent: 6311888 (2001-11-01), Funada et al.
patent: 6399426 (2002-06-01), Capote et al.
patent: 6439447 (2002-08-01), Minamitani et al.
patent: 6458236 (2002-10-01), Takeshita et al.
patent: 6518677 (2003-02-01), Capote et al.
patent: 6566234 (2003-05-01), Capote et al.
patent: 6589376 (2003-07-01), Davis et al.
patent: 6653743 (2003-11-01), Galuschki et al.
patent: 6774493 (2004-08-01), Capote et al.
patent: 6903463 (2005-06-01), Takeichi et al.
patent: 6916684 (2005-07-01), Stepniak et al.
patent: 6926796 (2005-08-01), Nishida et al.
patent: 6981317 (2006-01-01), Nishida
patent: 6982492 (2006-01-01), Rumer et al.
patent: 7081675 (2006-07-01), Yim et al.
patent: 2002/0056906 (2002-05-01), Kajiwara et al.
patent: 2005/0087891 (2005-04-01), Rumer et al.
patent: 2006/0055053 (2006-03-01), Yamazaki et al.
patent: 2007/0013067 (2007-01-01), Nishida et al.
patent: 0 622 149 (1994-11-01), None
patent: 834919 (1998-04-01), None
patent: 866109 (1998-09-01), None
patent: 954208 (1999-11-01), None
patent: 58028337 (1983-02-01), None
patent: 62-6652 (1987-02-01), None
patent: 4-99034 (1992-03-01), None
patent: 5-013119 (1993-01-01), None
patent: 5-070750 (1993-03-01), None
patent: 05167212 (1993-07-01), None
patent: 05170220 (1993-07-01), None
patent: 6-66355 (1994-08-01), None
patent: 6-333965 (1994-12-01), None
patent: 8-222599 (1996-08-01), None
patent: 08213434 (1996-08-01), None
patent: 8-298271 (1996-11-01), None
patent: 9-36177 (1997-02-01), None
patent: 9-162229 (1997-06-01), None
patent: 9-266229 (1997-10-01), None
patent: 10-004097 (1998-01-01), None
patent: 10-013002 (1998-01-01), None
patent: 10-084014 (1998-03-01), None
patent: 10-226770 (1998-08-01), None
patent: 10-256296 (1998-09-01), None
patent: 10-256306 (1998-09-01), None
patent: 10-289969 (1998-10-01), None
patent: 10-308417 (1998-11-01), None
patent: 10-321669 (1998-12-01), None
patent: 10-335389 (1998-12-01), None
patent: 10335373 (1998-12-01), None
patent: 2000-31345 (2000-01-01), None
patent: 2000-223534 (2000-08-01), None
patent: 98/30073 (1998-07-01), None
patent: 00/13229 (2000-03-01), None
Abstract for JP 05167212 1993.
Machine translation for JP 05167212 2008.
Abstract for JP 08213434 1996.
Machine translation of JP 10335373 date unknown.
Office Action issued Mar. 19, 2009 in U.S. Appl. No. 11/527,461.

Affiliated with

Also associated with

Rating

Electronic component mounting method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic component mounting method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic component mounting method and apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2696778