Electronic component mounting method and apparatus

Details Electronic component mounting method and apparatus Electronic component mounting method and apparatus

1998-06-15

2000-12-12

Martin-Wallace, Valencia

Metal working

Method of mechanical manufacture

Electrical device making

29720, 29739, 29740, 29741, 29743, 29834, 29832, 700 13, 700 56, 700 95, 700258, 700259, 700302, H05K 330

Patent

active

061581178

ABSTRACT:
The behavior of a nozzle tip is measured with a jig when the suction nozzle moves vertically and rotatively before the start of production. The nozzle tip displacement is formulated from the results with a component thickness and a mounting angle used as parameters, and the parameters are corrected according to the component thickness and the final mounting angle of the electronic component to be mounted in the production stage.

REFERENCES:
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patent: 5541834 (1996-07-01), Tomigashi et al.
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patent: 5724722 (1998-03-01), Hashimoto
patent: 5729895 (1998-03-01), Kim
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patent: 5926950 (1999-07-01), Asai et al.
Database WPI, Section PQ, Week 9820, Derwent Pub. Ltd., London, GB; Class P56, AN 98-227134, XP002078740 & JP 10 070 397 A (Yamagata Casio KK) (Abstract).

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