Electronic component mounting method

Details Electronic component mounting method Electronic component mounting method

2007-07-17

2007-07-17

Chang, Richard (Department: 3726)

Metal working

Method of mechanical manufacture

Electrical device making

C029S833000, C029S739000, C029S740000, C029S720000

Reexamination Certificate

active

10838442

ABSTRACT:
In an electronic component mounting method, a camera transporting mechanism transports a camera to a component supplying unit to take an image of a component. Thereafter the camera is evacuated from an upper area of the component. The image taken by the camera is processed by a recognition processing unit to acquire a position of the component. A mounting head transporting mechanism positions the mounting head to the component based upon the recognition processing unit, and the component is picked up by the mounting head. Another camera transporting mechanism transports another camera over a board to take an image of the board. Thereafter, the camera is evacuated from an upper area of the board. The image taken of the board is processed by another recognition processing unit to determine a mounting position. The mounting head then positions the component on the board based upon the determined mounting position.

REFERENCES:
patent: 5547537 (1996-08-01), Reynolds et al.
patent: 5743001 (1998-04-01), Baker et al.
patent: 5778525 (1998-07-01), Hata et al.
patent: 7137195 (2006-11-01), Haji et al.
patent: 02143434 (1990-06-01), None

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