Electronic component mounting method

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C029S832000, C029S833000, C029S836000, C029S720000, C029S744000, C257S777000, C257S786000, C382S151000

Reexamination Certificate

active

06938335

ABSTRACT:
A component mounting method recognizes reference marks on a printed circuit board and an electronic component, and uses these reference marks to determine a shift between a position of the circuit board and a position of the electronic component. This shift is corrected and then the electronic component is mounted to the printed circuit board such that electrical connecting portions of the circuit board are connected to electrical connecting portions of the electronic component. The reference marks are formed simultaneously with corresponding electrical connecting portions via a mask, such that in order to accurately position the electrical connecting portions, it is only necessary to accurately relatively position the reference marks.

REFERENCES:
patent: 4731923 (1988-03-01), Yagi et al.
patent: 4896034 (1990-01-01), Kiriseko
patent: 5172468 (1992-12-01), Tanaka et al.
patent: 5297333 (1994-03-01), Kusaka
patent: 5381307 (1995-01-01), Hertz et al.
patent: 5414519 (1995-05-01), Han
patent: 5512712 (1996-04-01), Iwata et al.
patent: 5644102 (1997-07-01), Rostoker
patent: 5726502 (1998-03-01), Beddingfield
patent: 5805421 (1998-09-01), Livengood et al.
patent: 5822191 (1998-10-01), Tagusa et al.
patent: 6168971 (2001-01-01), Love et al.
patent: 6195454 (2001-02-01), Yazawa
patent: 6476499 (2002-11-01), Hikita et al.
patent: 6593168 (2003-07-01), Ehrichs et al.
patent: 1-157433 (1989-10-01), None
patent: 4-40538 (1992-04-01), None
patent: 4-370995 (1992-12-01), None
patent: 5-267803 (1993-10-01), None
patent: 6-288732 (1994-10-01), None
patent: 7-142634 (1995-06-01), None
patent: 7-303000 (1995-11-01), None
patent: 8-293671 (1996-11-01), None
Burr-Brown,Integrated Circuits Data Book Supplement, vol. 33C, 1992, p. 6.1.39.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Electronic component mounting method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic component mounting method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic component mounting method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3406937

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.