Electronic-component mounting head, electronic-component mountin

Details Electronic-component mounting head, electronic-component mountin Electronic-component mounting head, electronic-component mountin

1998-03-18

2000-01-11

Young, Lee

Metal working

Method of mechanical manufacture

Electrical device making

29712, 29740, 29743, H05K 330

Patent

active

060122226

ABSTRACT:
A mounting head, a mounting apparatus, and a mounting method which are capable of contacting an electronic component with a substrate with a small contact load and mounting the component on the substrate, are provided. A suction device 120 is fit on a splined axis portion 118 of a support shaft 84 via a ball spline 126, is biased downward by a first spring 130, and is biased upward by a second spring 134. A suction nozzle 124 is attached to a nozzle holder 122 by engaging engagement ridges 172 of sheet springs 166 fixed to the suction nozzle 124 with engagement grooves 144 of the nozzle holder 122, respectively. Prior to the mounting of electronic components 178, a relationship between contact load and position of lift 28 is obtained, and a position to which the lift 28 is moved downward for mounting each electronic component 178 is pre-determined. Thus, each component 178 is contacted with a printed circuit board with an appropriate load. Each component 178 is contacted with the circuit board with a small load, by removing the self weight of the suction device 120 owing to the biasing action of the second spring 134 and reducing the frictional resistance produced between the suction device 120 and the axis member 84 owing to the provision of the ball spline 126.

REFERENCES:
patent: 4510683 (1985-04-01), Fedde et al.
patent: 4515507 (1985-05-01), Asai et al.
patent: 4527327 (1985-07-01), Van Deuren
patent: 4611397 (1986-09-01), Janisiewicz et al.
patent: 4747198 (1988-05-01), Asai et al.
patent: 4850780 (1989-07-01), Safabakhsh et al.
patent: 4858308 (1989-08-01), Komori
patent: 4860438 (1989-08-01), Chen
patent: 4950011 (1990-08-01), Borcea, et al.
patent: 5033783 (1991-07-01), Izumi et al.
patent: 5060366 (1991-10-01), Asai et al.
patent: 5159745 (1992-11-01), Kato
patent: 5168622 (1992-12-01), Peyroux
patent: 5195235 (1993-03-01), Mifuji
patent: 5384956 (1995-01-01), Sakurai et al.
patent: 5400497 (1995-03-01), Watanabe et al.
patent: 5462446 (1995-10-01), Ikeya
patent: 5657533 (1997-08-01), Fukui et al.
patent: 5701821 (1997-12-01), Asai et al.
patent: 5727409 (1998-03-01), Inoue et al.

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