Electronic component mounting device

Details Electronic component mounting device Electronic component mounting device

1998-09-17

2001-04-17

Arbes, Carl J. (Department: 3729)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S721000, C029S741000, C029S743000

Reexamination Certificate

active

06216336

ABSTRACT:

FIELD OF TECHNIQUE
The present invention relates generally to an electronic parts mounting device used in mounting on a printed board surface mountable chip type electronic parts employed in a variety of electronic equipment.
BACKGROUND ART
Conventionally, such electronic parts mounting devices are roughly classified into general purpose mounting devices using robots and high-speed mounting devices with a rotary mounting portion. As one of the robot type general purpose mounting devices, what is disclosed in Japanese Patent First Publication No. 6-85492 is known which includes, as shown in
FIG. 9
, an electronic parts supplying portion
70
having disposed thereon cassettes
77
designed to supply taped electronic parts in sequence, a substrate holding portion
79
holding a printed board
75
, a mount head portion
72
having an electronic parts suction nozzle
71
installed slidably to mount electronic parts on the printed board
75
, a first drive shaft
73
having the mount head portion
72
installed slidably, and a second drive shaft
74
driving the first drive shaft
73
in a direction perpendicular to the first drive shaft
73
and which is so designed that the mount head portion
72
moves in XY directions to suck the electronic parts, one by one, supplied, in sequence, from the electronic parts supplying portion
70
to mount them on the printed board
75
.
As one of the rotary type high-speed mounting devices, what is disclosed in Japanese Patent First Publication No. 7-202491 is known which includes, as shown in a major portion perspective view of
FIG. 10
, a rotary head
81
which has a plurality of suck nozzles
82
arranged in a circumferential portion thereof and which turns intermittently, a parts supplying portion
80
on an X-Y table
83
movable to a stop position of the suck nozzles
82
, a recognition portion
86
recognizing electronic parts sucked by the suck nozzles
82
, and the X-Y table
83
movable in two perpendicular directions while holding the printed board
85
on which electronic parts are to be mounted. The disclosed mounting device is designed to suck, recognize, and mount the electronic parts through intermittent rotation of the rotary head
81
.
There is an increasing need for small-sized, low-priced, and high-speed electronic parts mounting devices. The robot type general purpose mounting device having the above described conventional structure is compact and simple in structure, but has the drawback in that a high-speed operation cannot be achieved because the electronic parts are sucked one by one and then mounted on the printed board
75
. Additionally, the rotary type high-speed mounting device is fast in mounting tact because of a high-speed operation of the rotary head
81
, but has the disadvantages that an ultra high-speed operation is not achieved because it has a structure which sucks the electronic parts one by one and that facilities are bulky and the price of the facilities is high. Electronic mounting devices of the type intermediate between the both devices as described above are, thus, expected to be realized.
DISCLOSURE OF THE INVENTION
It is, accordingly, an object of the present invention to provide an electronic parts mounting device which is capable of solving the above prior art problems and which is compact and achieves a highspeed operation.
To achieve this object, the electronic parts mounting device of the invention has a compact structure wherein a plurality of suck nozzles and a plurality of cassettes supplying electronic parts in sequence are arranged at the same pitches, and drive mechanisms for driving the cassettes arranged at the same pitches are provided one for each of the cassettes and achieves a high-speed operation.


REFERENCES:
patent: 661114 (1900-10-01), Williams
patent: 4670976 (1987-06-01), Stridsberg
patent: 4794689 (1989-01-01), Seno et al.
patent: 4951383 (1990-08-01), Amao et al.
patent: 5135601 (1992-08-01), Klose et al.
patent: 5235739 (1993-08-01), Pedall
patent: 5294035 (1994-03-01), Asai et al.
patent: 5323528 (1994-06-01), Baker
patent: 5390872 (1995-02-01), Cipolla et al.
patent: 5419802 (1995-05-01), Nakatsuka et al.
patent: 5553809 (1996-09-01), Oku
patent: 5628107 (1997-05-01), Nushiyama et al.
patent: 5784777 (1998-07-01), Asai et al.
patent: 5809639 (1998-09-01), Alvite
patent: 5840594 (1998-11-01), Tsubouchi et al.
patent: 5855059 (1999-01-01), Togami et al.
patent: 5860208 (1999-01-01), Nomura
patent: 5873691 (1999-02-01), Asai et al.
patent: 5894657 (1999-04-01), Kanayama et al.
patent: 61-204700 (1986-11-01), None
patent: 1-317000 (1989-12-01), None
patent: 3-70199 (1991-03-01), None
patent: 08191199 (1996-07-01), None

Affiliated with

Also associated with

Rating

Electronic component mounting device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic component mounting device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic component mounting device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2546606