Electronic component mounting apparatus with setting device...

Details Electronic component mounting apparatus with setting device... Electronic component mounting apparatus with setting device...

2008-04-25

2010-12-14

Trinh, Minh (Department: 3729)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S712000, C029S833000, C414S737000

Reexamination Certificate

active

07849588

ABSTRACT:
An electronic component mounting apparatus includes a component feeding device that supplies an electronic component to a pickup position, a suction nozzle that picks up the electronic component supplied to the pickup position and mounts the picked up electronic component on a printed board, a height level detection device that measures height levels of the printed board positioned in a mounting position, a monitor graphically that displays a warping state of a sample printed board positioned in the mounting position based on height level measurements by the height level detection device on predetermined positions of the sample printed board, a setting device that sets measurement positions for actual mounting operations using the monitor, a converting device that converts the set measurement positions into coordinates on the printed board, and a memory that stores the converted coordinates of the set measurement position.

REFERENCES:
patent: 5749142 (1998-05-01), Hanamura
patent: 6356352 (2002-03-01), Sumi et al.
patent: 6530517 (2003-03-01), Kou
patent: 7032298 (2006-04-01), Sin
patent: 7200925 (2007-04-01), Hata et al.
patent: 7587814 (2009-09-01), Suhara
patent: 2006-286707 (2006-10-01), None

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